Competitive Analysis

Logic Product Development Project

Device 74AUP1G386GM
Function 3 input XOR with Schmitt trigger inputs

Datasheet local online

Competitor NXP

Package 6-XSON5

Die Size 536u X 414u Thickness 204u

Die Orientation Active Surface Up

Technology AUP 3.6V to 0.8V

Die Photo
	Die Overview Observations: Active circuits under bond pads. Circa 2005.

Die X-rays NXP 74AUP1G386GM
	Top View Observation: No metallic mounting pad for die. Low-Z mount material. Balls on both ends of bond Stitch bond appears on ball that is on the die. Reverse bonded. Die is severely skewed leftward
	Side View
	Angled View Observation: Stitch bond appears on ball that is on the die. Reverse bonded.

Package Details NXP 74AUP1G386GM
	Top View Size relative to 1mm on ruler.
	Top View Alternate
	Bottom